Reston, Va.; July 16, 2019 - The PMMI Foundation, a part of PMMI, The Association for labels and Processing Technologies, announces the winners of three $5,000 scholarships to pupils mastering food and beverage processing, mechanical engineering and electrical engineering at four-year PMMI Education partners.
 
The recipients of these scholarships are:
•              Daniel Mauger, Purdue University Northwest, Electrical Engineering Technology
•              Hitech Moryani, Illinois Institute of Technology, Food Process Engineering
•              Jacob Zaguri, University of Illinois at Chicago, Mechanical Engineering
'These students represent the great potential of the next generation workforce to transform the packaging and processing industry,' says Kate Fiorianti, senior education manager, PMMI. 'The application criteria, which contains notable industry involvement, means we are recognizing the best and cleverest and giving them resources to transfer academic success into professional excellence.'
 
The PMMI Foundation awards over $200,000 in funds each year to students enrolled in PMMI Education Partner programs, demonstrating PMMI's commitment to developing future leaders of the packaging and processing industry.
 
There are various opportunities to lead to the PMMI Foundation at the upcoming PACK EXPO Las Vegas and co-located Healthcare Packaging EXPO (Sept. 23-25, 2019; Las Vegas Convention Center). Proceeds from The Amazing Packaging Race and the CareerLink LIVE @ PACK EXPO interview and networking event provide right to PMMI's scholarship offerings. The PMMI Foundation also allows donations to support its endeavours. To donate, mail checks to PMMI Education & Training Foundation, P.O. Box 791042, Baltimore, MD 21279-1042.



This article is originally posted on Tronserve.com